Intermetallic Compounds Formed during the interfacial Reactions of Liquid Sn and Sn-3.5Ag Solders with Ag Thick Films
| Year | 2002 |
| Author | 曹龍泉, T. L. Su, S. Y. Chang, T. H. Chuang* |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 否 |
| Publication year | 2002 |
| Publication month | 5 |
| Journal name | J. Mater. Eng. Perf. |
| Publication area | 中華民國 |
| Volume | 11 |
| Issue | 5 |
| Start page | 481 |
| End page | 486 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |