Forming and Bonding Microchannels for the Manufacture of IC Chip Heat Dissipators

Forming and Bonding Microchannels for the Manufacture of IC Chip Heat Dissipators

Year2002
AuthorT. H. Chuang*, P. H. Chen, Y. H. Tseng, 曹龍泉, S. S. Wang, S. Y. Chang
Author count6
Created date2019-02-19
Author order第四(以上)作者
Corresponding author
Publication year2002
Publication month6
Journal name J. Mater. Sci. Eng
Publication area中華民國
Volume34
Issue2
Start page73
End page78
Publication type
Review system
LanguageForeign Language
Attached project