Active Soldering of Indium Tin Oxide (ITO) with Cu in Air using an Sn3.5Ag4Ti(Ce,Ga) Filler

Active Soldering of Indium Tin Oxide (ITO) with Cu in Air using an Sn3.5Ag4Ti(Ce,Ga) Filler

Year2003
AuthorS. Y. Chang, 曹龍泉, C. N. Tung, G. H. Pan, T. H. Chuang*
Author count5
Created date2019-02-19
Author order第二作者
Corresponding author
Publication year2003
Publication month4
Journal nameJ. Mater. Eng. Perf.
Publication area中華民國
Volume12
Issue4
Start page383
End page389
Publication type
Review system
LanguageForeign Language
Attached project