Intermetallic Compounds Formed During the Reflow of In-49Sn Solder Ball Array Packages
Year | 2003 |
Author | T. H. Chuang,*, 曹龍泉, H. M. Wu |
Author count | 3 |
Created date | 2019-02-19 |
Author order | 第二作者 |
Corresponding author | 否 |
Publication year | 2003 |
Publication month | 3 |
Journal name | Journal of Electronic Materials |
Publication area | 中華民國 |
Volume | 3 |
Issue | 3 |
Start page | 195 |
End page | 200 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |