Thermo-mechanical Behavior of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling

Thermo-mechanical Behavior of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling

Associate Professor    08-7703202#7454、(L)7480    c123@mail.npust.edu.tw
Year2004
AuthorChien C.H., 陳永昌*, Hsieh C.C., Chiou Y.T., Wu Y.D., Chen T.P.
Author count6
Created date2019-02-19
Author order第二作者
Corresponding author
Publication year2004
Publication month4
Journal nameExperimental Mechanics
Publication area中華民國
Start page214
End page220
Publication type
Review system
LanguageForeign Language
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