Thermo-mechanical Behavior of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling
Thermo-mechanical Behavior of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling
Year | 2004 |
Author | Chien C.H., 陳永昌*, Hsieh C.C., Chiou Y.T., Wu Y.D., Chen T.P. |
Author count | 6 |
Created date | 2019-02-19 |
Author order | 第二作者 |
Corresponding author | 是 |
Publication year | 2004 |
Publication month | 4 |
Journal name | Experimental Mechanics |
Publication area | 中華民國 |
Start page | 214 |
End page | 220 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |