Evaluation of Microwave Material of Low K Interconnection for RF Package

Evaluation of Microwave Material of Low K Interconnection for RF Package

Year2006
Author楊茹媛*, , , ,
Author count5
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2006
Publication month1
Journal nameMicrowave & Opt. Tech. Lett
Publication area中華民國
Volume48
Issue8
Start page1675
Publication type
Review system
LanguageForeign Language
Attached project