Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
Year | 2008 |
Author | C.C. Chi, 曹龍泉, C.W. Tsao, T.H. Chuang* |
Author count | 4 |
Created date | 2019-02-19 |
Author order | 第二作者 |
Corresponding author | 否 |
Publication year | 2008 |
Publication month | 1 |
Journal name | Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads |
Publication area | 中華民國 |
Volume | 17 |
Issue | 1 |
Start page | 134 |
End page | 140 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |