Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads

Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads

Year2008
AuthorC.C. Chi, 曹龍泉, C.W. Tsao, T.H. Chuang*
Author count4
Created date2019-02-19
Author order第二作者
Corresponding author
Publication year2008
Publication month1
Journal nameIntermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
Publication area中華民國
Volume17
Issue1
Start page134
End page140
Publication type
Review system
LanguageForeign Language
Attached project