Shear Strength and Failure Behavior of SnAgSb Solder Joints with Au/Ni-P/Cu UBM

Shear Strength and Failure Behavior of SnAgSb Solder Joints with Au/Ni-P/Cu UBM

Year2008
AuthorH.T. Lee*, S.Y. Hu, 洪廷甫, Y.F. Chen
Author count4
Created date2019-02-19
Author order第三作者
Corresponding author
Publication year2008
Publication month6
Journal nameJournal of Electronic Materials
Journal sponsorTMS
Publication area中華民國
Volume37
Issue6
Start page867
End page873
Publication type
Review system
LanguageForeign Language
Attached project