Finite Element Model Verification for Packaged Printed Circuit Board by Experimental Modal Analysis
Finite Element Model Verification for Packaged Printed Circuit Board by Experimental Modal Analysis
Year | 2008 |
Author | *, 王栢村, , , |
Author count | 5 |
Created date | 2019-02-19 |
Author order | 第二作者 |
Corresponding author | 否 |
Publication year | 2008 |
Publication month | 1 |
Journal name | Microelectronics Reliability |
Publication area | 中華民國 |
Volume | 48 |
Start page | 1837 |
End page | 1846 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |