Corrosion characterization of Sn37Pb solders and with cu substrate soldering reaction in 3.5wt.% NaCl solution
| Year | 2009 |
| Author | 曹龍泉* |
| Author count | 1 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2009 |
| Publication month | 8 |
| Journal name | 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HD |
| Publication area | 中華民國 |
| Start page | 1164 |
| End page | 1166 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |