Effect of In Addition on Sn-Ag-Sb Lead-Free Solder System
| Year | 2009 |
| Author | H.T. Lee*, F.F. Lee, 洪廷甫, H. W. Chen |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第三作者 |
| Corresponding author | 否 |
| Publication year | 2009 |
| Publication month | 1 |
| Journal name | IEEE Xplore, Electronic Materials and Packaging, 2008 |
| Publication area | 中華民國 |
| Start page | 191 |
| End page | 194 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |