Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder
| Year | 2010 |
| Author | 曹龍泉*, T. T. Lo, S. F. Peng, S. Y. Chang |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2010 |
| Publication month | 8 |
| Journal name | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging |
| Journal sponsor | IEEE |
| Publication area | 中華民國 |
| Start page | 1013 |
| End page | 1017 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |