Effect of Cooling Rate on Ag3Sn Formation in Sn-Ag Based Lead-free Solder
Year | 2009 |
Author | H.T. Lee, Y.F. Chen, 洪廷甫*, K.T. Shih |
Author count | 4 |
Created date | 2019-02-19 |
Author order | 第三作者 |
Corresponding author | 是 |
Publication year | 2009 |
Publication month | 12 |
Journal name | IEEE Xplore |
Publication area | 中華民國 |
Start page | 875 |
End page | 878 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |