Effect of Ti Element Addition on the Microstructure and Microhardness of Lead-free Sn3.5Ag0.5Cu Alloy
Effect of Ti Element Addition on the Microstructure and Microhardness of Lead-free Sn3.5Ag0.5Cu Alloy
Year | 2011 |
Author | 朱中平, 曹龍泉* |
Author count | 2 |
Created date | 2019-02-19 |
Author order | 第二作者 |
Corresponding author | 是 |
Publication year | 2011 |
Publication month | 6 |
Journal name | 鑄造工程學刊 |
Journal sponsor | 台灣鑄造學會 |
Publication area | 中華民國 |
Start page | 29 |
End page | 34 |
Publication type | |
Review system | 否 |
Language | Traditional Chinese |
Attached project | 無 |