Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder

Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder

Year2010
Author曹龍泉*, T. T. Lo, S. F. Peng, S. Y. Chang
Author count4
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2010
Publication month8
Journal name2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
Publication area中華民國
Start page1013
End page1017
Publication type
Review system
LanguageForeign Language
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