Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
Year | 2010 |
Author | 曹龍泉*, S.Y. Chang, C.I. Lee, W.H. Sun, C.H. Huang |
Author count | 5 |
Created date | 2019-02-19 |
Author order | 第一作者 |
Corresponding author | 是 |
Publication year | 2010 |
Publication month | 3 |
Journal name | Materials and Design |
Journal sponsor | Elsevier |
Publication area | 中華民國 |
Issue | 31 |
Start page | 4831 |
End page | 4835 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |