Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints
Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints
Year | 2010 |
Author | 曹龍泉*, B. C. Wang, C. W. Chang, M. W. Wu |
Author count | 4 |
Created date | 2019-02-19 |
Author order | 第一作者 |
Corresponding author | 是 |
Publication year | 2010 |
Publication month | 8 |
Journal name | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging |
Journal sponsor | IEEE |
Publication area | 中華民國 |
Start page | 250 |
End page | 253 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |