Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film
Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film
Year | 2017 |
Author | |
Created date | 2019-01-16 |
Author order | 第一作者 |
Corresponding author | 否 |
Publication year | 2017 |
Publication month | 10 |
Journal name | Journal of the Chinese Institute of Engineers |
Publication area | 中華民國 |
Volume | ---- |
Issue | 33 |
Publication type | |
Review system | 是 |
Language | Foreign Language |
Attached project | ---- |