Influence of Die-shift-distance of Overhang Dies on Residual Thermal Shear Stress in 5-chip SiP after EMC Curing
| Year | 2016 |
| Author | |
| Created date | 2019-01-16 |
| Author order | 第三作者 |
| Corresponding author | 是 |
| Publication year | 2016 |
| Publication month | 2 |
| Journal name | Materials and Design |
| Publication area | 荷蘭王國 |
| Volume | 512–521 |
| Issue | 92 |
| Publication type | |
| Review system | 是 |
| Language | Foreign Language |
| Attached project | 無 |