Influence of die-shift-distance of overhang dies on residual thermal shear stress in 5-chip SiP after EMC curing

Influence of die-shift-distance of overhang dies on residual thermal shear stress in 5-chip SiP after EMC curing

Professor    6007、7554    whl@mail.npust.edu.tw
Year2016
Author
Created date2019-01-16
Author order第一作者
Corresponding author
Publication year2016
Publication month2
Journal nameMaterials and Design
Publication area英國
Volume92
Issue----
Publication type
Review system
LanguageForeign Language
Attached project----