Optimum Conditions of Molding VFBGA Chips with Very Minimal Gold Wire Damage Using the Taguchi Methods
| Year | 2015 |
| Author | |
| Created date | 2019-01-16 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2015 |
| Publication month | 6 |
| Journal name | Materials Science in Semiconductor Processing |
| Publication area | 荷蘭王國 |
| Volume | 297~304 |
| Issue | 34 |
| Publication type | |
| Review system | 是 |
| Language | Foreign Language |
| Attached project | 無 |