Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging

Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging

Year2015
Author
Created date2019-01-16
Author order第一作者
Corresponding author
Publication year2015
Publication month2
Journal nameJournal of Materials Science - Materials in Electronics
Publication area英國
Volume----
Issue26
Publication type
Review system
LanguageForeign Language
Attached projectNSC 97-2218-E-020-004