Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging
Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging
Year | 2015 |
Author | |
Created date | 2019-01-16 |
Author order | 第一作者 |
Corresponding author | 是 |
Publication year | 2015 |
Publication month | 2 |
Journal name | Journal of Materials Science - Materials in Electronics |
Publication area | 英國 |
Volume | ---- |
Issue | 26 |
Publication type | |
Review system | 是 |
Language | Foreign Language |
Attached project | NSC 97-2218-E-020-004 |